Integrated battery pack with lead frame connection

ABSTRACT

An integrated battery package, that contains semiconductor chips, for example to control and regulate battery charging and to monitor the package operation, uses a single lead frame to interconnect several internal chips, to internally connect said control chips to the battery and to connect the whole package assembly externally. The invention eliminates the need for any additional connecting mechanism. The invention uses established production processes. A molding process, similar to plastic chip encapsulation, encloses the battery controlling chips and forms at the same time the body of the battery package. An additional cover, sealed to said body, closes the battery package.

BACKGROUND OF THE INVENTION

(1) Field of the Invention

This invention relates generally to a battery assembly, and moreparticularly to an assembly technique to incorporate electronicfunctions within removable battery packs, where all components areinterconnected using a lead frame technology.

(2) Description of Prior Art

Many portable electronic devices require removable battery packs.Sometimes electronic monitoring and control functions communicatingbetween the battery and said electronic device are incorporated withinthe battery pack. Usually the bare battery cells have to be mountedtogether with any required electronics into a sealed housing withexposed electrical contacts to connect the pack to the electronic deviceusing it.

Normally, semiconductor chips are mechanically connected to achip-carrier, typically a lead frame in today's technology, which isthen connected to a printed circuit board. Further connecting deviceswould then connect to said printed circuit board. A plastic case with abottom and top element would then enclose the whole assembly Integratedsemiconductor modules often use the lead frame technology to carry thesemiconductor chip and to connect the chip pads with a larger printedcircuit board. These lead frames are normally encapsulated with aconvenient plastic material. FIG. 1 (prior art) shows the cross sectionsof two typical examples of said semiconductor modules. FIG. 2 shows abare lead frame, which is produced as a long tape of metal sheet. Thebasic material of lead frames is sheet metal. The leads are eithermetal-stamped or etched to form the leads, therefore complex forms ofsaid leads can be achieved. The leads are typically pre-formed in abending process to accommodate all kinds of shapes. A frame area aroundall leads holds said leads in position, until the chips are mounted andthe assembly has been encapsulated (molded) into plastic material.

U.S. patent (U.S. Pat. No. 5,498,903 to Dioxin et al.) describes anintegrated circuit package of the surface-mountable type within which abattery is mounted. Battery leads extend from the side of the packagebody opposite that which is adjacent the circuit board when mounted, andbetween which a conventional battery may be placed. A gap is presentbetween the housing and the battery. The gaps thermally insulate thebattery from the package body and housing, so that the circuit may besubjected to solder reflow mounting to a circuit board, while insulatingthe high temperature from the battery.

U.S. patent (U.S. Pat. No. 6,109,530 to Larson et al.) discloses achip-battery micro-module and fabrication there of wherein an integratedcircuit “chip” is secured to a battery coin cell using variousconductive and insulating layers that provide power to the chip. Thechip-battery micro-module may be used to power an electronic accessorythat is directly attached thereto, such as an LCD display or speaker, orto power a circuit in a smart card or electronic device such as aportable phone. The chip battery micro-module can be integrated into aplastic smart card.

U.S. patent (U.S. Pat. No. 6,284,406 B1 to Xing et al) shows an IC cardcomprising an electronic device and a battery within a plastic card forelectrically energizing the electronic device. The battery is comprisedas a monolithic electrochemical cell having a lithium-containingcathode, a carbon anode, and a porous polymer separator infused withelectrolyte solution. The cell has a thickness of less than 0.7 mm. Thebattery has an overall thickness of less than 0.8 mm.

SUMMARY OF THE INVENTION

A principal object of the invention described herein is to build anintegrated battery package, that contains semiconductor chips, forexample to control and regulate battery charging and to monitor packageoperation, and that interconnects several of said internal chips,connects said chips to the battery within the package and connects thewhole package assembly to the outside. The basic aspects of an assemblyare to reduce the connection devices to a minimum and where the packageis a smooth sided box.

In the disclosed invention, a single lead frame, specially designed andtailored for the envisioned task, serves several purposes: it connectsthe, possibly multi-chip electronic circuits, it connects the batterycells to said multichip circuit and it forms, without any additionalparts, the external connectors of the completed package. A moldingprocess, similar to some semiconductor module packaging technologies,encapsulates the inner section of the lead frame together with theassembled semiconductor chips and possibly other electrical componentswith plastic material into a small, probably flat, package. According tothis invention, said mold is designed to form the bottom structure ofthe total package within that same production step. Several leads of thelead frame are pre-formed to attach to the battery cells. Two or moreleads of said single lead frame are also pre-formed to finally build theexternal contacts. Finally, after the battery cells are mounted andconnected to said lead frame, the package will be closed and sealed witha top cover, leaving only the essential external contacts being exposedoutside.

According to the objectives, the lead frame may internally connect oneor more semiconductor chips; it may also interconnect to other activeand/or passive components, like capacitors. Some of said leads of saidlead frame will be formed to accommodate a connection to said batterycells and other leads will be formed to build the external connection ofthe final package assembly. Forming of said leads can be realized duringthe original manufacturing process of said lead frames or pre-formingcan be processed as a separate bending process before the electroniccomponents are mounted to said lead frame. A separate bending processcan even be performed after said semiconductor and other chips aremounted to said lead frame and after the inner section of the lead frametogether with said mounted chips is encapsulated.

Further, according to the objectives of this invention, said moldingprocess, encapsulating said semiconductor chips and the inner area ofthe lead frame, also forms the body structure of said battery packagewith an optimized design of said mold. The body, preferably designed asa flat structure, can also accommodate the fixture for said batterycells and form a lid to hold a top cover in place.

The lead frame can be manufactured in one of several processes, forexample metal stamping and metal etching. Semiconductor chips and saidpassive components, like capacitors, may be attached to said lead framewith a known technique, like wire bonding, solder balls, solder pads andsimilar established processes. After molding the inner section, theouter frame, which holds the leads in their position during themanufacturing process, is cut away.

The battery cells could be electrically contacted to said leads bywelding or with conductive adhesives or by similar means. The externalconnector may be placed on the same side or on opposites sides of thepackage and they may be placed in the bottom surface, parallel to thelead frame plane.

Finally, to get a smooth sided box, the whole battery package will mostlikely be closed with an additional cover element, put over the mountedbattery cells and sealed to said body of the package. The pre-formedexternal contacts are then the only remaining connection to the packageoutside.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings, forming a material part of thisdescription, there is shown:

FIGS. 1 a and 1 b (Prior Art) shows a cross section of semiconductormodules, using lead frame technology.

FIG. 2 (Prior Art) shows a single section of a lead frame tape as usedin semiconductor packaging.

FIG. 3 shows the plain lead frame, according to the disclosureinvention.

FIG. 4 shows said lead frame with controller and capacitor chipsmounted.

FIG. 5 visualizes said lead frame with mounted chips, encapsulated in amolded package.

FIG. 6 shows the same molded package, forming the integrated packagebody, after the external frame to hold the leads in place is cut off.

FIG. 7 demonstrates said integrated package body with the batterymounted on it.

FIG. 8 shows the cover put over the integrated package body and batteryassembly.

FIG. 9 shows a cross-section of said molded body with external batterypackage connectors at the face side of said body.

FIG. 10 shows a cross-section of said molded body with external batterypackage connectors at the bottom side of said body.

FIG. 11 shows the basic steps of the production process.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A principal object of the invention described in the present document isto build an integrated battery package in a smooth sided box, thatcontains semiconductor chips, for example to control and regulatebattery charging and to monitor package operation, and thatinterconnects several of said internal chips, connects said chips to thebattery within the package and connects the whole package to theoutside. The basic aspect is to reduce the connection devices to aminimum.

The disclosed invention uses a similar lead frame technology and asimilar molding technology, as used for semiconductor module packaging.In the disclosed invention, a single lead frame, specially designed forthe envisioned purpose, is used. According to the invention, said leadframe serves several purposes at the same time: the first is to connectto the, possibly multi-chip electronic circuits, second, it connects thebattery cells to said multichip circuit and it forms and third, withoutany additional parts, it builds the external connectors of the completedpackage.

An example for such lead frame is presented in FIG. 3. Lead frames canbe manufactured in one of several processes, for example metal stampingand metal etching. The outer Frame out-Frame 3 holds all leads duringthe manufacturing process in place. Some of said leads of said leadframe will be formed to accommodate a connection to said battery cellsand other leads will be formed to build the external connection of thefinal package. ChipCon 3 are the connection areas where the variouschips will later be contacted. pref-Lead 3 points to the preformed leadsfor battery cells and for external package contacts. FIG. 4, shows saidlead frame with the semiconductor chips Chip and the passive componentspass-Comp mounted. The semiconductor chips and said passive components,like capacitors, may be attached to said lead frame with a knowntechnique, like wire bonding, solder balls, solder pads and similarestablished processes.

Typical semiconductor modules encapsulate the inner section of the leadframe together with the connected chip by molding this assembly withconvenient plastic material into a small, often flat, package. A similarmolding concept and process is used for this invention, howeveradditionally the mold is designed to form the bottom body of the totalpackage in that same production step. The result of said molding processis shown in FIG. 5, the lead frame and the already mounted chips areencapsulated with a plastic material. The resulting structure will alsoserve as the body Body 5 of the total package. The chips are now buriedinside the molded part, only said connections for battery cellsBatt-Conn 5 and external connections ext-Conn 5 remain visible.

Forming said leads could be realized during the original manufacturingprocess of said lead frames. Pre-forming can also be processed as aseparate bending process before said semiconductor and other chips aremounted to said lead frame. A separate bending process can even beperformed after said semiconductor and other chips are mounted to saidlead frame and after the inner section of the lead frame together withsaid mounted chips is encapsulated by molding the lead frame and chipassembly.

In a next process step after molding the body, the outer area of saidlead frame is being cut away, which results in the body package as shownin FIG. 6. Only the battery connection Batt-Conn 6 and the externalconnectors ext-Conn 6 remain visible. All other leads, that temporarilyserved to hold the internal leads in place, are cut off at the pointscut-Lead.

Then the battery cells are mounted; a principal concept for a possiblesolution is presented in FIG. 7, with the body Body 7 and the batteryBatt. The battery cells could be electrically contacted to said batteryconnection Batt-Conn 7, by welding or with conductive adhesives or bysimilar means. Finally as shown in FIG. 8 the cover Cover is put overthe assembled body and battery Body 8 and the package may be sealed. Thepre-formed external contacts ext-Conn 8 are then the only remainingconnection to the package outside. The external connector may be placed,for example, on the same side or on opposites sides of the package andthey may be placed in the bottom surface, parallel to the lead frameplane. FIG. 9 and FIG. 10 show two possible examples for positioningsaid external contacts. Sem-Chip 9 and Sem-Chip 10 are the semiconductorchips, contacted to said lead frame with solder balls Batt Conn 1 9/1 10and Batt Conn 2 9/2 10 are the battery connection in this example; ExtConn right is a possible solution as shown in FIG. 9; Ext Conn bottom isa similar solution as shown in FIG. 10.

The production process of the integrated battery package involvesseveral steps: in a first step 111 a flat lead frame is produced bystamping or etching or a similar process. Then in step 112 the leads forbattery connection and for external connectors may be pre-formed. Now in113 the semiconductor chips, and possibly other passive components aremounted 114. Further, in 115, the semiconductor chips and other passivecomponents will be electrically connected to the lead frame. Then theinner section of lead frame and the mounted chips and components areencapsulated with plastic material by the molding process, step 116. Thesame molding process also forms the package body, 117. In the next step118 the battery cells will be mounted and the battery contacts arewelded or glued to the battery cells 119. Now close and seal the packagewith a top cover in the final step 120.

While the invention has been particularly shown and described withreference to the preferred embodiments thereof, it will be understood bythose skilled in the art that various changes in form and details may bemade without departing from the spirit and scope of the invention.

1. An integrated battery package, comprising: one or more battery cellsinside the package; one or more semiconductor chips to control thebattery operation; a single lead frame, mechanically carrying saidsemiconductor chips and providing electrical connection to saidsemiconductor chips, to said battery cells inside the package as well asproviding connectors to the package outside; a plastic mold,encapsulating said semiconductor chips and the inner area of said leadframe; and said plastic mold forming, at the same time, the supportingstructure of said integrated battery package.
 2. The assembly of claim 1wherein some of the leads of said lead frame are preformed into a form,building the battery contacts.
 3. The assembly of claim 1 wherein someof the leads of said lead frame are preformed into a form, building theexternal contacts of said battery package.
 4. The assembly of claim 1wherein said one or more semiconductor chips control and regulatebattery charging and monitor the package operation.
 5. The assembly ofclaim 1 wherein said one or more semiconductor chips are connected tothe lead frame connectors by wire bonding.
 6. The assembly of claim 1wherein said one or more semiconductor chips are connected to the leadframe connectors with solder balls.
 7. The assembly of claim 1 whereinadditional passive components are mounted to said lead frame and areelectrically connected to said semiconductor chip through said leadframe.
 8. The assembly of claim 7 wherein said additional passivecomponents are additional capacitors.
 9. The assembly of claim 1 whereinsaid plastic mold, forming the supporting structure, forms the bottompart of the case of said battery package.
 10. The assembly of claim 1wherein one or more additional case elements form the top cover of thecase for said battery package.
 11. The assembly of claim 10 wherein saidadditional case elements forming the top cover of the case of saidbattery package, enclose all internal components and connections,including the semiconductor to battery connection, only leaving theessential external connections being exposed outside said case.
 12. Theassembly of claim 10 wherein said additional case elements forming thetop cover of the case of said battery package are fixed and sealed tosaid bottom part of the case of said battery package with a sealingadhesive.
 13. The assembly of claim 1 wherein said lead frame is formedto carry the external connection on opposite sides of the total packageassembly.
 14. The assembly of claim 1 wherein said lead frame is formedto carry the external connection on the same side of the total packageassembly.
 15. The assembly of claim 1 wherein said lead frame is formedto carry the external connection on the bottom side of the total packageassembly.
 16. A process to form an integrated battery package,comprising: providing one or more battery cells inside the package, oneor more semiconductor chips to control the battery operation, a singlelead frame, mechanically carrying and electrically connecting to saidsemiconductor chips, connecting to said battery cells inside the packageand providing the connectors to the package outside, a plastic mold,encapsulating said semiconductor chips and the inner area of said leadframe and said plastic mold forming, at the same time, the supportingstructure of said integrated battery package; forming some of the leadsof said lead frame into a form to build the battery contacts formingsome of the leads of said lead frame into a form to build the externalcontacts of said battery package; mounting said semiconductor chips tosaid lead frame; connecting said semiconductor chips to said lead frame;molding a plastic material around said semiconductor chips and the innerarea of said lead frame forming, though the mechanical design of themold, the supporting structure of said integrated battery package. 17.The process of claim 16 wherein some of the leads of said lead frame arepreformed during said lead frame's production process.
 18. The processof claim 16 wherein some of the leads of said lead frame are preformedin a separate bending process, but before the various chips are mounted.19. The process of claim 16 wherein some of the leads of said lead frameare formed in a separate bending process, after the various chips aremounted and the after said molding process, encapsulating saidsemiconductor chips and said inner area of said lead frame.
 20. Theprocess of claim 16 wherein said lead frame is made with metal stamping.21. The process of claim 16 wherein the lead frame is made with metaletching.
 22. The process of claim 16 wherein said leads preformed into aposition matching the battery contacts are welded to said battery. 23.The process of claim 16 wherein said leads preformed into a positionmatching the battery contacts are fixed to said battery with conductiveadhesive material.
 24. The process of claim 16 wherein additionalpassive components are mounted to said lead frame and are electricallyconnected to said semiconductor chip through said lead frame.
 25. Theprocess of claim 16 wherein one or more additional case elements formthe top cover of the case of said battery package and enclose allinternal components and connections, including the semiconductor tobattery connection, only leaving the essential external connectionsbeing exposed outside said case.
 26. The process of claim 25 whereinsaid additional case elements forming the top cover of the case of saidbattery package are fixed and sealed to said bottom part of the case ofsaid battery package with a sealing adhesive.